Home Flexible Printed Circuits Automated Equipment Copper Plating Process [Desmear] Desmear Desmear 用途說明:移除多層板因鑽孔後所留下的膠渣(smear),達到內層銅與孔銅導通,並防止孔銅拉離,除此之外能使孔壁粗化,以利後製程化學銅有更好的附著表面。*詳細規格請參閱附加檔案 Attachments: TRM112.pdf