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Copper Plating Process
[VCP Copper Plating Machine/RTR Horizontality Copper Plating Machine]
VCP Copper Plating Machine
VCP Copper Plating Machine
用途說明:
在FPC製程中雙面板流程的NC工程
(NC鑽孔→黑孔電鍍 →硫酸銅電鍍) 。
將雙面銅箔鑽出導通孔,再將導通孔以
電鍍製程使兩層導通。
*詳細規格請參閱附加檔案